Job Opening: Digital Verification Engineer

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Tasks and Responsibilities

  • Verify digital logic using SystemVerilog and reusable, standardized methodologies. Verify digital systems that use both custom and standard IP components and interconnects, including microprocessor cores and hierarchical memory subsystems.
  • Contribute to verification and modeling at the chip top level.
  • Debug tests with design engineers to deliver functionally correct design blocks. Work closely with the design and test teams to define test specifications, verification plans and manufacturing transfer.

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Job opening: Senior Mixed-Signal IC Design Engineer

Job Opening: Senior Mixed-signal IC Design Engineer

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Tasks and Responsibilities

  • Specification of the analog and mixed signal blocks that are embedded in the system (ADC, DAC, PLL, data interfaces, optoelectronics …).
  • Design (from schematic to full verification at extracted level) of the analog and mixed-signal blocks in sub-nanometric CMOS processes. It means being involved in the full AMS design flow: system-level design, schematic, layout and full verification.
  • Definition of layout guidelines for layout engineers and review of their work.
  • Collaboration with the test engineers for the testing definition of the fabricated ICs. Review and analysis of lab characterization data for validation and correlation with simulation results.

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KDPOF Contact information

Job Opening: Digital Firmware-Software Engineer

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Tasks and Responsibilities

Member of the R&D team in charge of the development of embedded firmware running on the company integrated circuits microprocessors, as well as development of the test programs used in production testing. The responsibilities of the Firmware/Test Engineer also include:

  • Development of the continuous integration tests of the microprocessor firmware during ASIC prototyping.
  • Participate in specification and review of the PCBs used to implement the production testing of the company’s products.
  • Participation on the development of technology evaluation vehicles as well as software development kits.
  • Automatization of laboratory tests and measurements using programming languages like Matlab, TCL, Python.

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Job Opening: Production Engineer

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Tasks and Responsibilities

Person in charge of production test continuous improvement, analysis of production data and product reliability assurance. The responsibilities of the Production Engineer include:

  • Improvement of the test programs used in production, to optimize the test time, coverage and yield, while guaranteeing product reliability
  • Analysis of production data (test results, PCM, etc.)
  • Processing of wafer test data for generation of wafer maps used for assembly
  • Definition of test flows for specification of parametric limits and criteria for functional pass/fail
  • Participation in the definition and execution of reliability tests and qualification flows

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Display of High-speed Data Communications at IEEE SA Ethernet & IP @ Automotive Technology Day

Successful Demo of High-speed Data Communications at IEEE Auto Tech Day

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KDPOF has displayed their high-speed connectivity solutions for the communications in vehicle data networks at the IEEE SA Ethernet & IP @ Automotive Technology Days from November 3 to 4, 2021 in Munich, Germany, and online. Optical connectivity perfectly solves the electrical challenges and interference in vehicles thanks to its low weight, low cost, and electromagnetic compatibility due to inherent galvanic isolation. Read more

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Extensive evaluation kit EVK9351AUT from KDPOF eases project start for optical gigabit connectivity in vehicles

EVK9351AUT Accelerates Project Launch for Optical Gigabit Connectivity

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KDPOF presents the new extensive evaluation kit EVK9351AUT for a quick and easy project launch of optical gigabit connectivity in vehicles. “Our new EVK9351AUT equips carmakers, suppliers, and test houses to fully evaluate the KDPOF automotive transceivers KD9351 and KD1053 for automotive optical 1000BASE-RHC PHY implementation,” explained Carlos Pardo, CEO and Co-founder of KDPOF. “We thus support our recently announced new integrated KD9351 Fiber Optic Transceiver (FOT) for comprehensive evaluation.” Read more

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Integrated KD9351 FOT from KDPOF nominated for Product of the Year 2022 by Elektronik Journal

Integrated KD9351 FOT Nominated for Product of the Year 2022 by Elektronik Journal

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The German electronics journal “Elektronik” by WEKA Publishing has nominated KDPOF’s integrated KD9351 FOT for product of the year 2022. “We are proud to be one of the ten finalists in the automotive category,” stated Carlos Pardo, CEO and Co-founder of KDPOF. “With the KD9351 FOT, we significantly lower costs by constructing the transimpedance amplifier, photodiode, LED driver, and LED as one single device. We consequently provide efficient optical technology for safe backbone and ADAS sensor links in vehicles.” Read more

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New Funzin AIoT Platform FAIP 3.0 and Edge AI Device Photon integrate KDPOF KD9351 and KD1053 for autonomous vehiclesFunzin

Funzin Integrates KDPOF ICs in New Devices “FAIP 3.0” and “Photon”

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KDPOF proudly announces that Funzin, software development and edge AI solution company, have integrated their KD1053 IC and integrated KD9351 FOT (fiber optic transceiver) in the new Funzin AIoT Platform “FAIP 3.0” and Edge AI Device “Photon” for automotive. “An automated driving car requires networks capable of controlling and processing a great deal of sensor data,” explained Ms. Deuk Hwa Kim, CEO/President of Funzin. “Our automotive network solution features an Ethernet backbone environment based on plastic optical fiber (POF) to eliminate electronic wave interference.” Read more

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KDPOF on RTVE: Automotive Chips Made in Spain

KDPOF on RTVE: Automotive Chips Made in Spain

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Report by RTVE: The Madrid-based company KDPOF, based in Tres Cantos, will put chips on the market in 2024. The shortage and the EU’s commitment to attract the technology industry, a business opportunity.

Spanish Company Willing to Manufacture Chips ‘Made in Spain’ in the Midst of Supply Crisis

There is a shortage of chips, that’s a fact. The causes of this supply crisis are diverse: distribution problems stemming from the pandemic, increased demand and even geostrategic issues. But experts agree that one of the most influential factors is the enormous technical complexity behind the manufacture of each chip. Read more

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Multi-gigabit Networking Demands Complete Optical Communications System - WEKA Bordnetz-Kongress 2021

Multi-gigabit Networking Demands Optical System Solution

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At the virtual Wire Harness Congress (Bordnetz-Kongress) by WEKA Publishing on September 22, 2021, KDPOF displayed the status of optical multi-gigabit connectivity in vehicles. In their presentation, Juergen Schachtschneider, Automotive Manager Central Europe & Greater China, and César Esteban, Applications & Support Manager, proposed a complete optical communications system, which is under development by KDPOF and their industry partners.
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