Our CTO Rubén Pérez-Aranda Alonso will give the presentation “An optical nervous system to Interconnect Sensors and artificial brains in AV” at AutoSens USA from May 21 to 24 in Detroit, USA: “I am very excited to speak this year at AutoSens USA, and I appreciate this great opportunity to present the technology development that is happening around automotive optical links.” In addition, we’ll show our latest demo setup in the exhibition area.
An optical nervous system to Interconnect Sensors and artificial brains in AV
Sensors connectivity with Artificial Intelligence (AI) central units with reliability, low latency and high data rate is key in Advance Driver Assistance Systems (ADAS) and Autonomous Vehicles (AV). Optical interconnections are very well positioned because of the high required data rates for connecting sensors and AI brains with superior EMC performance and future-proven data rate density scalability.
Compared with data-center automotive applications require much wider range of operating temperatures (-40 ºC to 125 ºC) and superior reliability. A new optical physical layer standard has been released in March 2023, IEEE Std 802.3cz, supporting rates between 2.5 and 50 Gb/s.
The presentation will cover the reasons behind the use of in-vehicle optical communications. It will highlight the main characteristics and why a new standard different of data-center was developed. Differences between automotive and data-center applications will be explained in detail, attending to requirements, physical layer design strategy, photonics, digital signal processing (DSP), link budget, dependability functions, and other distinctive automotive features.
As the core of the implementation of the whole solution is the optical transceiver. The presentation will explain why traditional implementation approaches of optical transceivers, from circuit design and IC packaging points of view, are not longer valid for automotive and which new approaches are needed. The presentation will cover new approaches attending to technology nodes, analog-digital design partitioning, photonics and optics integration, as well as optical fiber connection. All together is designed to provide to the automotive industry a low cost, low power and reliable device that can be seamless integrated in small foot-print sensors (e.g. cameras) and Electronics Control Units (ECUs).
Qualification and advance reliability assessment are key for automotive. The presentation will also explain the limitations found in standard documents and how important is considering specific mission profiles and the reliability models of the most important failure modes at semiconductor and package levels. Photonics components are key part of the transceiver. Because of that, it will be also explained in detail about how automotive temperature requirements and reliability mission profile have shaped the wavelength selection.