Rubén Pérez de Aranda is CTO and Co-founder of KDPOF

Our CTO Rubén Pérez-Aranda Alonso will give the presentation “An optical nervous system to Interconnect Sensors and artificial brains in AV” at AutoSens USA from May 21 to 24 in Detroit, USA: “I am very excited to speak this year at AutoSens USA, and I appreciate this great opportunity to present the technology development that is happening around automotive optical links.” In addition, we’ll show our latest demo setup in the exhibition area.

An optical nervous system to Interconnect Sensors and artificial brains in AV

Sensors connectivity with Artificial Intelligence (AI) central units with reliability, low latency and high data rate is key in Advance Driver Assistance Systems (ADAS) and Autonomous Vehicles (AV). Optical interconnections are very well positioned because of the high required data rates for connecting sensors and AI brains with superior EMC performance and future-proven data rate density scalability.

Compared with data-center automotive applications require much wider range of operating temperatures (-40 ºC to 125 ºC) and superior reliability. A new optical physical layer standard has been released in March 2023, IEEE Std 802.3cz, supporting rates between 2.5 and 50 Gb/s.

The presentation will cover the reasons behind the use of in-vehicle optical communications. It will highlight the main characteristics and why a new standard different of data-center was developed. Differences between automotive and data-center applications will be explained in detail, attending to requirements, physical layer design strategy, photonics, digital signal processing (DSP), link budget, dependability functions, and other distinctive automotive features.

As the core of the implementation of the whole solution is the optical transceiver. The presentation will explain why traditional implementation approaches of optical transceivers, from circuit design and IC packaging points of view, are not longer valid for automotive and which new approaches are needed. The presentation will cover new approaches attending to technology nodes, analog-digital design partitioning, photonics and optics integration, as well as optical fiber connection. All together is designed to provide to the automotive industry a low cost, low power and reliable device that can be seamless integrated in small foot-print sensors (e.g. cameras) and Electronics Control Units (ECUs).

Qualification and advance reliability assessment are key for automotive. The presentation will also explain the limitations found in standard documents and how important is considering specific mission profiles and the reliability models of the most important failure modes at semiconductor and package levels. Photonics components are key part of the transceiver. Because of that, it will be also explained in detail about how automotive temperature requirements and reliability mission profile have shaped the wavelength selection.

Meet KDPOF at AutoSens

We look forward to meeting you in Detroit! Please contact us to set up a date. We’re happy to pass on a 15 percent discount with the code ASUSASPEAKER15 at AutoSens registration.

OFC: KDPOF presents new implementation of IEEE 802.3cz Std.

At the OFC – Optical Fiber Communication – Conference, we will exhibit our brand-new multi-gigabit connectivity demo at stand 5623 from March 26 to 28 in San Diego, California, USA, and online. Our setup will show a new implementation in silicon of the IEEE 802.3cz standard. It will operate in multimode multi-gigabit with 2 plates of multimode fiber at 10GBASE-AU.

“As of today, the IEEE 802.3cz standard technology provides the only existing solution for 25 Gb/s and 50 Gb/s single lane connections with 4 inline connectors and a maximum length of 40 meters in the car over OM3 multimode fiber,” explained Luisma Torres Torres, Principal System Architect at KDPOF and active member at IEEE Standards Association.

Future-proof: Robust, Low Power, Scalable

The IEEE 802.3cz-2023 (nGBASE-AU) standard has been designed from scratch with the goal of meeting stringent automotive requirements. The use of glass optical fiber improves power consumption. In addition, it is more resilient to aging problems. It is absolutely future-proof since ECUs can be upgraded to higher speeds while keeping the same harness. The standard specifies speeds of 2.5, 5, 10, 25, and 50 Gb/s per lane. It meets automotive temperature requirements of -40 °C to +105 °C and OEM reliability requirements with a minimum of 15 years of operation with 10 FIT.

About OFC Conference

OFC is the premier global event for optical fiber communications and networking professionals, attracting attendees from around the world to a conference and exhibition that showcases the latest industry advancements and emerging technologies. In 2024, OFC expects to welcome over 13,000 participants from 74 countries, 87 media outlets and have more than 603 exhibiting companies in its exhibition halls. This global event serves as the platform for start-ups to make their debut and industry leaders to set the pace for what’s to come. Event organizers provide a compelling series of exciting programs and events covering the entire ecosystem with a focus on inclusivity.


We look forward to meeting you! Make sure to reserve your free exhibit pass today at OFC registration. Please contact us to set up a meeting.

KDPOF receives IPCEI investments to build an optoelectronics packaging plant in Spain

This is a translated extract of the article “PERTE Chip o la ambición de situar a España enel mapa de los semiconductores” by Marilés de Pedro for Newsbook, first published on 5 February 2024 in Spanish.

‘It is the most ambitious PERTE of the Strategic Projects for Economic Recovery and Transformation. Approved in April 2022, the PERTE Chip has a budget of around 12,250 million euros until 2027 and aims to boost the semiconductor sector in Spain. A PERTE, in line with the provisions of the European Chip Law, which came into force last September and which seeks to promote the strategic autonomy of the EU in this critical area. In Spain, the first aid was granted last December to a total of 15 projects, totaling 50 million euros, thanks to the approval last October of the Addendum to the Recovery Plan, which made it possible to mobilize all the resources allocated to Spain from the NextGeneration EU funds …’

For the original publication, please see here.

As follows, please find the translation of the interview with our CEO Carlos Pardo:

KDPOF: Chips with Spanish Flavor

In the complex environment of chip manufacturing, it is possible to find innovative companies with a Spanish stamp. This is the case of KDPOF, founded in 2010, which has focused its activity, with great success, on the packaging and testing of optoelectronic chips. These chips, as Carlos Pardo, CEO and co-founder of the company, explains, link microelectronics and optics, so the encapsulation process connects both worlds. “The precision required in optics and the high speed demanded in microelectronics make potting a key part of the product,” he explains, and the company estimates that the potting and testing required for this type of chip accounts for more than 70% of the cost, so control of the manufacturing process is crucial. “Our encapsulation technology is robust, of a quality and at a price that is among the most advanced in the world,” he says. Although the main sector targeted by the Spanish company is the automotive market, its technology is applicable to other markets.

“We lead the world in the use of in-car optical communications,” says Pardo. These communications are indispensable “as the demand for high data transmission speeds has increased, with the arrival of cameras and other high-definition sensors, autonomous driving, the connected car and huge screens. The recipe, in his opinion, to do so passes through automation and robotization. “The development of Industry 4.0 or artificial intelligence, for example, are some of the technologies that can allow us to compete with countries that have a low cost of personnel”.

In the deployment of this activity, the Spanish company was awarded last June a part of the investment of the European Commission’s “Important Projects of Common European Interest” (IPCEI) program, estimated at 8.1 billion euros. The current investors in KDPOF and some banks are also betting on bringing manufacturing capacity to Spain,” he adds, optimistically believing that Spain can be a chip and semiconductor production center. “Not only can it, but it has to be. We have no future if we only focus on service, tourism and construction. Industry has to grow significantly, and more so in Spain.”

The company is currently embarking on an ambitious project to deconstruct a chip encapsulation factory to be located in Tres Cantos. The facility will consist of some 2,000 square meters of clean rooms where at least two lines will be set up, with the possibility of installing one more. The rooms will have different cleanliness categories, from ISO 6 to ISO 8, and will be able to carry out the so-called “wafer handling” or preparation and cutting of the silicon wafer and its subsequent testing, packaging, and final testing. In addition, there will be prototyping, qualification and R&D laboratories.” We want to reach 6 seconds per chip and, subsequently, optimize the process until we reach 3 seconds per chip”.

This is a project in which the Spanish company enjoys funding thanks to the European IPCEI program, with a budget of more than 50 million euros. Pardo explains that a large part of it will go to R&D activities. “Around 11 million euros have already been invested,” he says. “It is quite possible that the total invested, at the end of the project, set for 2028, will be significantly higher, to increase the capacity and efficiency of the lines”.

For the original publication, please see here.

Carlos Pardo is CEO and Co-founder of KDPOF

We’re proud to congratulate our CEO Carlos Pardo for being awarded Entrepreneur 2023. He’s winner of the 13th edition of the Entrepreneur Awards by Asociación/Colegio Nacional de Ingenieros del ICAI. On October 20, 2023, he will collect the XIII Entrepreneur Award at the ceremony of the 2023 Association Awards.

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KDPOF unveiled the future of automotive optical networks at ECOC

At the recent ECOC Exhibition from October 2 to 4, 2023, in Glasgow, Scotland, we were grateful to show you our exclusive and brand-new multi-gigabit demo “Unveiling the Future of Automotive Optical Networks” with a traffic generator from AUKUA Systems. Thank you very much for the great interest in our presenting the first automotive optical multi-gigabit demo. The event was once again the key meeting place for everyone in the fiber optic communication technology industry. With over 330 companies showcasing the latest products and services, the exhibition was the meeting place for their colleagues, customers and partners and the chance to hear about the latest developments in their industry.

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980nm wavelength VCSELs for higher robustness and lifetime // TRUMPF and KDPOF working together to implement new standard in optical data communication within automotive // The target is to bring to the market an integrated transceiver for multi-gigabit optical communications in automotive systems

TRUMPF Photonic Components, a global leader in high-speed VCSEL and photodiode solutions for data communication, and KDPOF, an expert in high-speed optical networking solutions based in Spain, will showcase the first 980nm multi-gigabit automotive interconnect system at the European Conference for Optical Communication (ECOC), to be held in Glasgow on October 1st-5th.

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KDPOF presentation at CHIPNATION 2023

We’re excited to present our optical gigabit connectivity technology and chip production plans at CHIPNATION Congress on 28 November 2023 in Getafe, Spain. It’s the first national congress of the Spanish semiconductor industry – Building the future of the European semiconductors industry.

From 13:15 to 14:00, our CEO Carlos Pardo will discuss “IPCEI and the capabilities deployed in Spain” at the round table, together with Jose Capmany, COO of iPronics Programmable Photonics, and Iñigo Artundo, CEO of VLC Photonics (Hitachi Group). Moderator will be Estela Gallego, Advisory Spokesperson, Directorate General for Industry and Small and Medium-sized Enterprises.
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Proof-of-Concept for Camera Interconnect at IEEE SA Ethernet & IP @ Auto Tech Day

At the 2023 IEEE SA Ethernet & IP @ Automotive Technology Day (E&IP@ATD) in September in São Paulo, Brazil, KDPOF presented “nGBASE-AU: New Multi-gigabit Glass Optical Fiber Automotive Ethernet Standard”. We’re grateful for the great interest in our exclusive and brand-new multi-gigabit demo “Unveiling the Future of Automotive Optical Networks” with a traffic generator from AUKUA Systems. In their conference presentation “nGBASE-AU: A New Multi-Gigabit Glass Optical Fiber Automotive Ethernet Standard. PoC for Camera Interconnection“, César Esteban and Luis Manuel Torres described and justified the approval and adoption of the new IEEE 802.3cz standard for multi-gigabit communications over glass optical fiber.

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We will present the first automotive optical multi-gigabit demo at the upcoming ECOC Exhibition from October 2 to 4, 2023. At the SEC in Glasgow, Scotland, we’re happy to show you our exclusive and brand-new multi-gigabit demo “Unveiling the Future of Automotive Optical Networks” with a traffic generator from AUKUA Systems. The setup will be available at scheduled sessions in a private meeting room. In order to book a free space for the demo presentation, please contact us beforehand or visit us onsite at stand 937.

Finalist for ECOC Exhibition Industry Awards 2023

We’re proud that our KD7251 multi-gigabit transceiver has been shortlisted as finalist for ECOC Exhibition Industry Awards for 2023. It’s nominated for most innovative Product Award in the category “Chip-Scale Packaging/Optical Sub Assembly”. The winners for each category will be announced live at the Product Focus theatre at ECOC Exhibition on Tuesday, October 3, from 11:40.

The awards emphasize technology and product commercialisation; they highlight significant achievements in advancing the business of optical communications, transport, networking, fibre-based products, photonic integration circuits and related developments. The ECOC committee have reviewed the progress of advanced technologies from research to commercialization including volume production as well as new and innovative products.

The categories for most innovative products are about looking across the industry—what new product is driving change in its respective market segment. What’s timely and helping to increase the use of optics. Metrics would include design features that are photonics, electronics, thermal, mechanical, chemical, environmental and carbon footprint based.

We look forward to meeting you in Glasgow! In order to schedule a meeting or book a free space for the demo presentation, please contact us beforehand or visit us onsite at stand 937.

Automotive Seminars with Würth Elektronik: EMC-compliant Optical High-speed Connectivity

Würth Elektronik and KDPOF will jointly present “EMC-compliant optical high-speed connectivity in automotive applications” in an automotive seminar on November 30, 2023 near Stuttgart, Germany. Designed by engineers and technicians, the seminar aims at people interested in practice-oriented content, to get support in the development of error-free electronics and devices. Francisco Sierra, RF Design Engineer at KDPOF, will give insights into our optical technology and present a Flyback Converter with common and differential mode interference. Live demos with plenty room for questions will round up the seminar day.

We’re proud of our technological cooperation with Würth Elektronik, one of the leading manufacturers of electronics and electromechanical components in Europe. Together we are advancing automotive multi-gigabit Ethernet over fiber optics. Read more