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Carlos Pardo presents "Automotive Multi-gigabit is Optical" at Automotive Ethernet Congress 2022

At the Automotive Ethernet Congress in June 2022 in Munich, Germany, Carlos Pardo gave the presentation “Automotive Multi-gigabit is Optical”. He showed how automotive optical Ethernet is reaching for 50 Gb/s.

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KDPOF proudly announced that their well-proven KD1053 PHY IC and integrated KD9351 FOT (Fiber Optic Transceiver) have been implemented by Renesas, a premier supplier of advanced semiconductor solutions, into the new next generation automotive vehicle computer VC4. This comprehensive communication gateway ECU from Renesas features the newest automotive network technologies and sufficient computing power to host the ever-increasing number of user applications. “With the VC4, we have integrated an optical Ethernet interface into our automotive evaluation boards for the first time,” stated Tobias Belitz, Principal Engineer at Renesas. “KDPOF shared their 1000BASE-RH transceiver KD1053 and KD9351 FOT according to IEEE 802.3bv with us, which also covers the wide temperature range we are looking at.”

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Automotive Ethernet Congress: Automotive Multi-gigabit is Optical

With new challenges like automated driving and electric power trains, In-Vehicle Network (IVN) requirements are quickly evolving. The IVN has to support use cases such as the vehicle data backbone, smart antennas, ADAS cameras/sensors, displays, and data loggers, which demand higher data bandwidth while maintaining the reliability level required by the automotive industry. When considering a standard technology to support the target use cases, it is clear that the requirements are not all met by any existing communication standard, including the optical 10GBASE-SR. It is thus necessary to define a new IVN standard for multi-gigabit optical communications in the automotive environment.

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VECS: KDPOF celebrated Proposed IEEE Optical Multi-gigabit Automotive Standard Achieving Milestone

At the recent VECS 2022 – Vehicle Electronics & Connected Services – International Trade Show from May 17 to 18, 2022 in Gothenburg, Sweden, KDPOF has celebrates the in-vehicle network standardization progress reaching the IEEE 802.3 Working Group Ballot stage. “We are happy that the IEEE 802.3cz automotive optical multi-gigabit technically complete standard draft has entered the Working Group ballot stage,” stated Carlos Pardo, KDPOF CEO and active participant in the IEEE 802.3 working group. Read more

KDPOF welcomes proposed IEEE optical multi-gigabit automotive Ethernet standard 802.3 achieving milestone

KDPOF congratulates the 802.3cz Task Force for the advance of the proposed IEEE 802.3cz standard to the IEEE 802.3 Working Group ballot stage. “We are happy that the IEEE 802.3 automotive optical multi-gigabit technically complete standard draft has entered the Working Group ballot stage,” stated Carlos Pardo, KDPOF CEO and active participant in the IEEE 802.3 working group. Read more

Automotive Multi-gigabit Optical Connectivity

This video about automotive multi-gigabit optical connectivity presents the standardized solution under development by KDPOF to reach a 50 Gb/s bit rate over 40 meters of wiring harness. In the process, we’ll comply with the hardest OEM’s EMC specs, and meeting all automotive requirements in terms of operational temperature, reliability, ageing, mechanical loads, chemical loads, dirtiness and harsh environments in general. And all this with outstanding low power and low cost. Please, follow us to the KDPOF labs and we’ll show you a demo of our multi-gigabit solution: 50 Gb/s optical transmission for automotive.

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Efficient optical technology from KDPOF for safe backbone in vehicles

KDPOF will give insight on “Automotive Communications Standards” at the IEEE Conference “Use of Standards in Industry: IoT, Robotics, Automotive, and Communications” on 20 April 2022 in Madrid, Spain. The IEEE event will discuss the importance of the different standards and their use and impact on the industry in different sectors such as automotive, communications, satellites, etc. In his presentation, Luis Manuel Torres, Principal Engineer at KDPOF and Editor-in-Chief of the IEEE 802.3cz standardization project “Multi-gigabit Optical Automotive Ethernet”, will give a general view of the most important automotive standards, with special emphasis on in-vehicle communication standards.

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Tasks and Responsibilities

  • Implement ASIC / SoCs / FPGAs for multiple products, starting at the specification & design phase, continuing through technology selection, implementation, and validation. Innovation in performance, power and cost to build the best possible product is a must.
  • Participate in all phases of ASIC / FPGA design flow (Synthesis, Place & Route, and Timing Closure) as required.
  • Work with backend teams to address any layout and timing issues for ASICs.
  • Verification by emulation with FPGAs in the lab.
  • Involvement in lead-up, validation, characterization and qualification phases of ASICs.

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Tasks and Responsibilities

  • Verify digital logic using SystemVerilog and reusable, standardized methodologies. Verify digital systems that use both custom and standard IP components and interconnects, including microprocessor cores and hierarchical memory subsystems.
  • Contribute to verification and modeling at the chip top level.
  • Debug tests with design engineers to deliver functionally correct design blocks. Work closely with the design and test teams to define test specifications, verification plans and manufacturing transfer.

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Job opening: Senior Mixed-Signal IC Design Engineer

Tasks and Responsibilities

  • Specification of the analog and mixed signal blocks that are embedded in the system (ADC, DAC, PLL, data interfaces, optoelectronics …).
  • Design (from schematic to full verification at extracted level) of the analog and mixed-signal blocks in sub-nanometric CMOS processes. It means being involved in the full AMS design flow: system-level design, schematic, layout and full verification.
  • Definition of layout guidelines for layout engineers and review of their work.
  • Collaboration with the test engineers for the testing definition of the fabricated ICs. Review and analysis of lab characterization data for validation and correlation with simulation results.

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