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VECS: KDPOF celebrated Proposed IEEE Optical Multi-gigabit Automotive Standard Achieving Milestone

VECS: KDPOF Celebrated Proposed IEEE Optical Multi-gigabit Automotive Standard Achieving Milestone

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At the recent VECS 2022 – Vehicle Electronics & Connected Services – International Trade Show from May 17 to 18, 2022 in Gothenburg, Sweden, KDPOF has celebrates the in-vehicle network standardization progress reaching the IEEE 802.3 Working Group Ballot stage. “We are happy that the IEEE 802.3cz automotive optical multi-gigabit technically complete standard draft has entered the Working Group ballot stage,” stated Carlos Pardo, KDPOF CEO and active participant in the IEEE 802.3 working group. Read more

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KDPOF welcomes proposed IEEE optical multi-gigabit automotive Ethernet standard 802.3 achieving milestone

Proposed IEEE Optical Multi-gigabit Automotive Standard Achieves Milestone

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KDPOF congratulates the 802.3cz Task Force for the advance of the proposed IEEE 802.3cz standard to the IEEE 802.3 Working Group ballot stage. “We are happy that the IEEE 802.3 automotive optical multi-gigabit technically complete standard draft has entered the Working Group ballot stage,” stated Carlos Pardo, KDPOF CEO and active participant in the IEEE 802.3 working group. Read more

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Automotive Multi-gigabit Optical Connectivity

High-speed Communications for Next-generation In-vehicle Networks

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This video about automotive multi-gigabit optical connectivity presents the standardized solution under development by KDPOF to reach a 50 Gb/s bit rate over 40 meters of wiring harness. In the process, we’ll comply with the hardest OEM’s EMC specs, and meeting all automotive requirements in terms of operational temperature, reliability, ageing, mechanical loads, chemical loads, dirtiness and harsh environments in general. And all this with outstanding low power and low cost. Please, follow us to the KDPOF labs and we’ll show you a demo of our multi-gigabit solution: 50 Gb/s optical transmission for automotive.

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Efficient optical technology from KDPOF for safe backbone in vehicles

Automotive Communications Standards Presentation at IEEE Conference “Use of Standards in Industry”

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KDPOF will give insight on “Automotive Communications Standards” at the IEEE Conference “Use of Standards in Industry: IoT, Robotics, Automotive, and Communications” on 20 April 2022 in Madrid, Spain. The IEEE event will discuss the importance of the different standards and their use and impact on the industry in different sectors such as automotive, communications, satellites, etc. In his presentation, Luis Manuel Torres, Principal Engineer at KDPOF and Editor-in-Chief of the IEEE 802.3cz standardization project “Multi-gigabit Optical Automotive Ethernet”, will give a general view of the most important automotive standards, with special emphasis on in-vehicle communication standards.

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Job Opening: Firmware/Test EngineerKDPOF

Job Opening: Digital RTL Engineer

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Tasks and Responsibilities

  • Implement ASIC / SoCs / FPGAs for multiple products, starting at the specification & design phase, continuing through technology selection, implementation, and validation. Innovation in performance, power and cost to build the best possible product is a must.
  • Participate in all phases of ASIC / FPGA design flow (Synthesis, Place & Route, and Timing Closure) as required.
  • Work with backend teams to address any layout and timing issues for ASICs.
  • Verification by emulation with FPGAs in the lab.
  • Involvement in lead-up, validation, characterization and qualification phases of ASICs.

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Job Opening: Digital Verification Engineer

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Tasks and Responsibilities

  • Verify digital logic using SystemVerilog and reusable, standardized methodologies. Verify digital systems that use both custom and standard IP components and interconnects, including microprocessor cores and hierarchical memory subsystems.
  • Contribute to verification and modeling at the chip top level.
  • Debug tests with design engineers to deliver functionally correct design blocks. Work closely with the design and test teams to define test specifications, verification plans and manufacturing transfer.

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Job opening: Senior Mixed-Signal IC Design Engineer

Job Opening: Senior Mixed-signal IC Design Engineer

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Tasks and Responsibilities

  • Specification of the analog and mixed signal blocks that are embedded in the system (ADC, DAC, PLL, data interfaces, optoelectronics …).
  • Design (from schematic to full verification at extracted level) of the analog and mixed-signal blocks in sub-nanometric CMOS processes. It means being involved in the full AMS design flow: system-level design, schematic, layout and full verification.
  • Definition of layout guidelines for layout engineers and review of their work.
  • Collaboration with the test engineers for the testing definition of the fabricated ICs. Review and analysis of lab characterization data for validation and correlation with simulation results.

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Job Opening: Production Engineer

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Tasks and Responsibilities

Person in charge of production test continuous improvement, analysis of production data and product reliability assurance. The responsibilities of the Production Engineer include:

  • Improvement of the test programs used in production, to optimize the test time, coverage and yield, while guaranteeing product reliability
  • Analysis of production data (test results, PCM, etc.)
  • Processing of wafer test data for generation of wafer maps used for assembly
  • Definition of test flows for specification of parametric limits and criteria for functional pass/fail
  • Participation in the definition and execution of reliability tests and qualification flows

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Display of High-speed Data Communications at IEEE SA Ethernet & IP @ Automotive Technology Day

Successful Demo of High-speed Data Communications at IEEE Auto Tech Day

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KDPOF has displayed their high-speed connectivity solutions for the communications in vehicle data networks at the IEEE SA Ethernet & IP @ Automotive Technology Days from November 3 to 4, 2021 in Munich, Germany, and online. Optical connectivity perfectly solves the electrical challenges and interference in vehicles thanks to its low weight, low cost, and electromagnetic compatibility due to inherent galvanic isolation. Read more

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New Funzin AIoT Platform FAIP 3.0 and Edge AI Device Photon integrate KDPOF KD9351 and KD1053 for autonomous vehiclesFunzin

Funzin Integrates KDPOF ICs in New Devices “FAIP 3.0” and “Photon”

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KDPOF proudly announces that Funzin, software development and edge AI solution company, have integrated their KD1053 IC and integrated KD9351 FOT (fiber optic transceiver) in the new Funzin AIoT Platform “FAIP 3.0” and Edge AI Device “Photon” for automotive. “An automated driving car requires networks capable of controlling and processing a great deal of sensor data,” explained Ms. Deuk Hwa Kim, CEO/President of Funzin. “Our automotive network solution features an Ethernet backbone environment based on plastic optical fiber (POF) to eliminate electronic wave interference.” Read more

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