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KDPOF on RTVE: Interview with Carlos Pardo about Microelectronics Industry in Spain

Spain had approved the Strategic Projects for Economic Recovery and Transformation with an important invest in microchips and technology companies. It is essential because we have in Spain some companies that create technological and electronic components and equipment but depend on Asia for manufacturing since they don’t have the capacity to produce microchips on their own. The project PERTE will invest an important quantity of Euros to help these companies for manufacturing. As Carlos Pardo stated in the interview, it could get an important growth in these small companies and also attract private invest resulting in a general economic growth.

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KDPOF proudly announced that their well-proven KD1053 PHY IC and integrated KD9351 FOT (Fiber Optic Transceiver) have been implemented by Renesas, a premier supplier of advanced semiconductor solutions, into the new next generation automotive vehicle computer VC4. This comprehensive communication gateway ECU from Renesas features the newest automotive network technologies and sufficient computing power to host the ever-increasing number of user applications. “With the VC4, we have integrated an optical Ethernet interface into our automotive evaluation boards for the first time,” stated Tobias Belitz, Principal Engineer at Renesas. “KDPOF shared their 1000BASE-RH transceiver KD1053 and KD9351 FOT according to IEEE 802.3bv with us, which also covers the wide temperature range we are looking at.”

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Automotive Ethernet Congress: Automotive Multi-gigabit is Optical

With new challenges like automated driving and electric power trains, In-Vehicle Network (IVN) requirements are quickly evolving. The IVN has to support use cases such as the vehicle data backbone, smart antennas, ADAS cameras/sensors, displays, and data loggers, which demand higher data bandwidth while maintaining the reliability level required by the automotive industry. When considering a standard technology to support the target use cases, it is clear that the requirements are not all met by any existing communication standard, including the optical 10GBASE-SR. It is thus necessary to define a new IVN standard for multi-gigabit optical communications in the automotive environment.

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VECS: KDPOF celebrated Proposed IEEE Optical Multi-gigabit Automotive Standard Achieving Milestone

At the recent VECS 2022 – Vehicle Electronics & Connected Services – International Trade Show from May 17 to 18, 2022 in Gothenburg, Sweden, KDPOF has celebrates the in-vehicle network standardization progress reaching the IEEE 802.3 Working Group Ballot stage. “We are happy that the IEEE 802.3cz automotive optical multi-gigabit technically complete standard draft has entered the Working Group ballot stage,” stated Carlos Pardo, KDPOF CEO and active participant in the IEEE 802.3 working group. Read more

Automotive Multi-gigabit Optical Connectivity

This video about automotive multi-gigabit optical connectivity presents the standardized solution under development by KDPOF to reach a 50 Gb/s bit rate over 40 meters of wiring harness. In the process, we’ll comply with the hardest OEM’s EMC specs, and meeting all automotive requirements in terms of operational temperature, reliability, ageing, mechanical loads, chemical loads, dirtiness and harsh environments in general. And all this with outstanding low power and low cost. Please, follow us to the KDPOF labs and we’ll show you a demo of our multi-gigabit solution: 50 Gb/s optical transmission for automotive.

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KD9351 from KDPOF awarded 2021 Product of the Year by Electronics Products Magazine

With the annual Product of the Year awards, now in its 46th year, Electronic Products Magazine recognizes outstanding products that represent any of the following qualities: a significant advancement in a technology or its application, an exceptionally innovative design, a substantial achievement in price/performance, improvements in design performance, and a potential for new product designs/opportunities. Electronic Products editors evaluated 150+ products across 10 categories. These are this year’s winners:

Analog Devices Inc. (Analog/Mixed-Signal ICs), Analog Devices Inc. (Digital ICs), Bourns (Passives), C&K (Electromechanical), Eggtronic (Power), Harwin (Interconnects), KDPOF (Optoelectronics), Liquid Instruments (Test & Measurement), Omnivision (Sensors), and u-blox (RF/Microwave).

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Funzin Integrates KDPOF ICs in New Devices “FAIP 3.0” and “Photon” for autonomous vehicles

At the recent CES 2022, Funzin and KDPOF have jointly presented their optical in-vehicle network solution for autonomous vehicles. Funzin, software development and edge AI solution company, have implemented KDPOF’s KD1053 PHY IC and integrated KD9351 FOT (fiber optic transceiver) in the new Funzin AIoT Platform “FAIP 3.0” and Edge AI Device “Photon” for automotive. Read more

EPIC New Product Event Featuring KDPOF’s Integrated KD9351 FOT

At the recent Members New Product Release Event by EPIC (European Photonics Industry Consortium), César Esteban has presented our integrated KD9351 FOT that reduces cost for gigabit connectivity, thus providing efficient optical technology for safe backbone and ADAS sensor links in vehicles.
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Interview of Alix Paultre, Electronic Design, with Kenny Yoon from KDPOF

Alix Paultre, editor of Electronic Design, has talked with Kenny Yoon, Business Development Manager for South Korea and India at KDPOF, about using optical networking to empower advanced automotive functionality. KDPOF provides innovative high-speed optical networking for harsh environments. Making gigabit communications over fiber optics a reality, KDPOF technology supplies 1-Gb/s plastic optical fiber (POF) links for automotive, industrial, and home networks.

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Tasks and Responsibilities

Person in charge of production test continuous improvement, analysis of production data and product reliability assurance. The responsibilities of the Production Engineer include:

  • Improvement of the test programs used in production, to optimize the test time, coverage and yield, while guaranteeing product reliability
  • Analysis of production data (test results, PCM, etc.)
  • Processing of wafer test data for generation of wafer maps used for assembly
  • Definition of test flows for specification of parametric limits and criteria for functional pass/fail
  • Participation in the definition and execution of reliability tests and qualification flows

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