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Tasks and Responsibilities

  • Implement ASIC / SoCs / FPGAs for multiple products, starting at the specification & design phase, continuing through technology selection, implementation, and validation. Innovation in performance, power and cost to build the best possible product is a must.
  • Participate in all phases of ASIC / FPGA design flow (Synthesis, Place & Route, and Timing Closure) as required.
  • Work with backend teams to address any layout and timing issues for ASICs.
  • Verification by emulation with FPGAs in the lab.
  • Involvement in lead-up, validation, characterization and qualification phases of ASICs.

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KD9351 from KDPOF awarded 2021 Product of the Year by Electronics Products Magazine

With the annual Product of the Year awards, now in its 46th year, Electronic Products Magazine recognizes outstanding products that represent any of the following qualities: a significant advancement in a technology or its application, an exceptionally innovative design, a substantial achievement in price/performance, improvements in design performance, and a potential for new product designs/opportunities. Electronic Products editors evaluated 150+ products across 10 categories. These are this year’s winners:

Analog Devices Inc. (Analog/Mixed-Signal ICs), Analog Devices Inc. (Digital ICs), Bourns (Passives), C&K (Electromechanical), Eggtronic (Power), Harwin (Interconnects), KDPOF (Optoelectronics), Liquid Instruments (Test & Measurement), Omnivision (Sensors), and u-blox (RF/Microwave).

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Funzin Integrates KDPOF ICs in New Devices “FAIP 3.0” and “Photon” for autonomous vehicles

At the recent CES 2022, Funzin and KDPOF have jointly presented their optical in-vehicle network solution for autonomous vehicles. Funzin, software development and edge AI solution company, have implemented KDPOF’s KD1053 PHY IC and integrated KD9351 FOT (fiber optic transceiver) in the new Funzin AIoT Platform “FAIP 3.0” and Edge AI Device “Photon” for automotive. Read more

EPIC New Product Event Featuring KDPOF’s Integrated KD9351 FOT

At the recent Members New Product Release Event by EPIC (European Photonics Industry Consortium), César Esteban has presented our integrated KD9351 FOT that reduces cost for gigabit connectivity, thus providing efficient optical technology for safe backbone and ADAS sensor links in vehicles.
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Interview of Alix Paultre, Electronic Design, with Kenny Yoon from KDPOF

Alix Paultre, editor of Electronic Design, has talked with Kenny Yoon, Business Development Manager for South Korea and India at KDPOF, about using optical networking to empower advanced automotive functionality. KDPOF provides innovative high-speed optical networking for harsh environments. Making gigabit communications over fiber optics a reality, KDPOF technology supplies 1-Gb/s plastic optical fiber (POF) links for automotive, industrial, and home networks.

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Tasks and Responsibilities

  • Verify digital logic using SystemVerilog and reusable, standardized methodologies. Verify digital systems that use both custom and standard IP components and interconnects, including microprocessor cores and hierarchical memory subsystems.
  • Contribute to verification and modeling at the chip top level.
  • Debug tests with design engineers to deliver functionally correct design blocks. Work closely with the design and test teams to define test specifications, verification plans and manufacturing transfer.

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Job opening: Senior Mixed-Signal IC Design Engineer

Tasks and Responsibilities

  • Specification of the analog and mixed signal blocks that are embedded in the system (ADC, DAC, PLL, data interfaces, optoelectronics …).
  • Design (from schematic to full verification at extracted level) of the analog and mixed-signal blocks in sub-nanometric CMOS processes. It means being involved in the full AMS design flow: system-level design, schematic, layout and full verification.
  • Definition of layout guidelines for layout engineers and review of their work.
  • Collaboration with the test engineers for the testing definition of the fabricated ICs. Review and analysis of lab characterization data for validation and correlation with simulation results.

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KDPOF Contact information

Tasks and Responsibilities

Member of the R&D team in charge of the development of embedded firmware running on the company integrated circuits microprocessors, as well as development of the test programs used in production testing. The responsibilities of the Firmware/Test Engineer also include:

  • Development of the continuous integration tests of the microprocessor firmware during ASIC prototyping.
  • Participate in specification and review of the PCBs used to implement the production testing of the company’s products.
  • Participation on the development of technology evaluation vehicles as well as software development kits.
  • Automatization of laboratory tests and measurements using programming languages like Matlab, TCL, Python.

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Tasks and Responsibilities

Person in charge of production test continuous improvement, analysis of production data and product reliability assurance. The responsibilities of the Production Engineer include:

  • Improvement of the test programs used in production, to optimize the test time, coverage and yield, while guaranteeing product reliability
  • Analysis of production data (test results, PCM, etc.)
  • Processing of wafer test data for generation of wafer maps used for assembly
  • Definition of test flows for specification of parametric limits and criteria for functional pass/fail
  • Participation in the definition and execution of reliability tests and qualification flows

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Display of High-speed Data Communications at IEEE SA Ethernet & IP @ Automotive Technology Day

KDPOF has displayed their high-speed connectivity solutions for the communications in vehicle data networks at the IEEE SA Ethernet & IP @ Automotive Technology Days from November 3 to 4, 2021 in Munich, Germany, and online. Optical connectivity perfectly solves the electrical challenges and interference in vehicles thanks to its low weight, low cost, and electromagnetic compatibility due to inherent galvanic isolation. Read more