Extensive evaluation kit EVK9351AUT from KDPOF eases project start for optical gigabit connectivity in vehicles

KDPOF presents the new extensive evaluation kit EVK9351AUT for a quick and easy project launch of optical gigabit connectivity in vehicles. “Our new EVK9351AUT equips carmakers, suppliers, and test houses to fully evaluate the KDPOF automotive transceivers KD9351 and KD1053 for automotive optical 1000BASE-RHC PHY implementation,” explained Carlos Pardo, CEO and Co-founder of KDPOF. “We thus support our recently announced new integrated KD9351 Fiber Optic Transceiver (FOT) for comprehensive evaluation.”

KDPOF Integrates KD9351 and KD1053 in Extensive Evaluation Kit to Facilitate Project Entry for Safe Backbone and ADAS Sensor Links in Vehicles

The platform provides all the functional and performance evaluation capabilities requested by automotive OEMs, Tier1s, and test houses. It therefore enables product designers to successfully evaluate KDPOF’s technology and shorten the time-to-market. The new KD9351, in combination with the continuing KD1053 IC, cuts the cost for 1 Gb/s optical connectivity by 30 percent, providing competitive pricing for EMC critical or galvanic isolated critical links. Applications include safe Ethernet backbones and sensor links for advanced driver assist systems (ADAS).

Evaluation Kit for 1000BASE-RHC Automotive Bridge

The extensive evaluation kit EVK9351AUT contains 2 EVB9351AUT evaluation boards, 2 evaluation board metal enclosures (optional), 2 1000BASE-T SFP modules, 2 100BASE-TX SFP modules (optional), 1 USB2ALL monitoring box, 1 optical harness, 2 Cat. 5e UTP cables, 2 direct-attach passive SFP twinax cables (optional), as well as user and design documentation.

The evaluation boards can operate at 100 and 1,000 Mb/s. A single version of a board is compatible with multiple headers and harnesses from different manufacturers. The user can plug a standard SFP module into the cage and have media converter functionality supporting Wake-Up & Sleep. Complementary items can be provided, such as optical harness, loopback SFP, or SFP direct-attach passive twinax cable. The board is configured in an EEPROM memory. The provided SDK allows the generation of binaries for different configuration options and flashing of the EEPROM. In addition, control and status of the KD1053 transceiver is accessed through the GUI (included in the SDK), which may be run on a computer connected via a USB2All module. The GUI includes several panels that provide complete access to the KDPOF transceiver, providing information on the link status and its parameters. User and design documentation is included in order to simplify the evaluation and the development of automotive end products based on the two-part numbers.

The EVK9351AUT evaluation kit can be ordered via sales@kdpof.com.

More information

EVK9351AUT automotive evaluation kit brochure
EVB9351AUT evaluation board brochure
Video: Connection and Traffic Testing with the Automotive Evaluation Kit

Tasks and Responsibilities

  • Verify digital logic using SystemVerilog and reusable, standardized methodologies. Verify digital systems that use both custom and standard IP components and interconnects, including microprocessor cores and hierarchical memory subsystems.
  • Contribute to verification and modeling at the chip top level.
  • Debug tests with design engineers to deliver functionally correct design blocks. Work closely with the design and test teams to define test specifications, verification plans and manufacturing transfer.

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KDPOF Contact information

Tasks and Responsibilities

Member of the R&D team in charge of the development of embedded firmware running on the company integrated circuits microprocessors, as well as development of the test programs used in production testing. The responsibilities of the Firmware/Test Engineer also include:

  • Development of the continuous integration tests of the microprocessor firmware during ASIC prototyping.
  • Participate in specification and review of the PCBs used to implement the production testing of the company’s products.
  • Participation on the development of technology evaluation vehicles as well as software development kits.
  • Automatization of laboratory tests and measurements using programming languages like Matlab, TCL, Python.

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Job opening: Senior Mixed-Signal IC Design Engineer

Tasks and Responsibilities

  • Specification of the analog and mixed signal blocks that are embedded in the system (ADC, DAC, PLL, data interfaces, optoelectronics …).
  • Design (from schematic to full verification at extracted level) of the analog and mixed-signal blocks in sub-nanometric CMOS processes. It means being involved in the full AMS design flow: system-level design, schematic, layout and full verification.
  • Definition of layout guidelines for layout engineers and review of their work.
  • Collaboration with the test engineers for the testing definition of the fabricated ICs. Review and analysis of lab characterization data for validation and correlation with simulation results.

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Tasks and Responsibilities

  • Implement ASIC / SoCs / FPGAs for multiple products, starting at the specification & design phase, continuing through technology selection, implementation, and validation. Innovation in performance, power and cost to build the best possible product is a must.
  • Participate in all phases of ASIC / FPGA design flow (Synthesis, Place & Route, and Timing Closure) as required.
  • Work with backend teams to address any layout and timing issues for ASICs.
  • Verification by emulation with FPGAs in the lab.
  • Involvement in lead-up, validation, characterization and qualification phases of ASICs.

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Efficient optical technology from KDPOF for safe backbone in vehicles

On August 13, 2021 from 11:00 a.m. to 12:30 p.m. IST (Indian Standard Time, 6:00 to 7:30 a.m. UTC), Óscar Ciordia, César Esteban, and Kenny Yoon will give the online seminar “The Use of Plastic Optical Fiber in the Automotive Industry”. The seminar is organized by the Society of Automotive Engineers India (SAE India).

Plastic Optical Fiber (POF) is becoming an integral part of the vehicle with interfaces to many different clusters of the electric/electronic systems in the automotive industry. POF is the medium of choice for automotive networks, primarily due to its versatility and is the best alternate solution to existing wiring technology. The key advantages of the optical solution are, among others, Electromagnetic Compatibility (EMC) thanks to its inherent galvanic isolation, robustness, low weight, and low cost. In his seminar, César Esteban will cover the following topics: the need for automotive wire line connectivity to evolve to Ethernet, advantages of optical links, use cases for fiber optics, as well as POF value chain and proposal.

For more information, please see the seminar brochure from SAE India.

Registration is open.

We are proud to participate in the EPIC (European Photonics Industry Consortium) network and connect with over 700 member companies in 35 countries. “EPIC is the ideal community to further drive the joint development and standardization of multi-gigabit technology in vehicles, which offers the automotive market an optical solution that is both competitive and robust,” stated Carlos Pardo. As the industry association with the largest network, EPIC fosters a vibrant photonics ecosystem by maintaining a strong network and acting as a catalyst and facilitator for technological and commercial advancement. In addition, it maintains the European photonics database. On these grounds, we are growing an ecosystem of partners that will be greatly fostered thanks to the EPIC cluster.

IEEE 802.3 Automotive Optical Multi-Gigabit Standard

With technological leaps such as electrical vehicles, automated driving, and V2X interconnection rushing forward, automotive applications, utilization, and safety requirements are boosting the necessary network speed tremendously. Consequently, in-vehicle networks are on the brink of speeds from one to multiple gigabits per second. With the approval of the IEEE 802.3 working group, a team of individuals affiliated with more than 15 key carmakers and components suppliers, including KDPOF, is working on the standardization of an IEEE 802.3 Automotive Optical Multi-Gigabit Standard with strong support from the industry.

The key advantages of the optical solution for specific applications using multi-gigabit speeds with in-vehicle connectivity are, among others, Electromagnetic Compatibility (EMC) thanks to the inherent galvanic isolation, low weight, and low cost. Use cases include the interconnectivity of telematics control modules, redundant and safe backbones for autonomous driving architectures, and advanced driver assist system (ADAS) sensors. The technology will be scalable in order to enable even higher data rates such as 50 and 100 Gbps in the future. By combining optimization in all areas of the new standard, the right balance of complexity and cost among all parts (CMOS IC, VCSEL, PD, ferrules, sleeves, cable, in-line connection technology, optics, and lenses, etc.) can be achieved in order to deliver the lowest cost, most reliable, and most highly scalable solution to the automotive market.