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Tag Archive for: automotive
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This video about automotive multi-gigabit optical connectivity presents the standardized solution under development by KDPOF to reach a 50 Gb/s bit rate over 40 meters of wiring harness. In the process, we’ll comply with the hardest OEM’s EMC specs, and meeting all automotive requirements in terms of operational temperature, reliability, ageing, mechanical loads, chemical loads, dirtiness and harsh environments in general. And all this with outstanding low power and low cost. Please, follow us to the KDPOF labs and we’ll show you a demo of our multi-gigabit solution: 50 Gb/s optical transmission for automotive.
KDPOF will give insight on “Automotive Communications Standards” at the IEEE Conference “Use of Standards in Industry: IoT, Robotics, Automotive, and Communications” on 20 April 2022 in Madrid, Spain. The IEEE event will discuss the importance of the different standards and their use and impact on the industry in different sectors such as automotive, communications, satellites, etc. In his presentation, Luis Manuel Torres, Principal Engineer at KDPOF and Editor-in-Chief of the IEEE 802.3cz standardization project “Multi-gigabit Optical Automotive Ethernet”, will give a general view of the most important automotive standards, with special emphasis on in-vehicle communication standards.
KDPOFTasks and Responsibilities
- Implement ASIC / SoCs / FPGAs for multiple products, starting at the specification & design phase, continuing through technology selection, implementation, and validation. Innovation in performance, power and cost to build the best possible product is a must.
- Participate in all phases of ASIC / FPGA design flow (Synthesis, Place & Route, and Timing Closure) as required.
- Work with backend teams to address any layout and timing issues for ASICs.
- Verification by emulation with FPGAs in the lab.
- Involvement in lead-up, validation, characterization and qualification phases of ASICs.
With the annual Product of the Year awards, now in its 46th year, Electronic Products Magazine recognizes outstanding products that represent any of the following qualities: a significant advancement in a technology or its application, an exceptionally innovative design, a substantial achievement in price/performance, improvements in design performance, and a potential for new product designs/opportunities. Electronic Products editors evaluated 150+ products across 10 categories. These are this year’s winners:
Analog Devices Inc. (Analog/Mixed-Signal ICs), Analog Devices Inc. (Digital ICs), Bourns (Passives), C&K (Electromechanical), Eggtronic (Power), Harwin (Interconnects), KDPOF (Optoelectronics), Liquid Instruments (Test & Measurement), Omnivision (Sensors), and u-blox (RF/Microwave).
At the recent CES 2022, Funzin and KDPOF have jointly presented their optical in-vehicle network solution for autonomous vehicles. Funzin, software development and edge AI solution company, have implemented KDPOF’s KD1053 PHY IC and integrated KD9351 FOT (fiber optic transceiver) in the new Funzin AIoT Platform “FAIP 3.0” and Edge AI Device “Photon” for automotive. Read more
At the recent Members New Product Release Event by EPIC (European Photonics Industry Consortium), César Esteban has presented our integrated KD9351 FOT that reduces cost for gigabit connectivity, thus providing efficient optical technology for safe backbone and ADAS sensor links in vehicles.
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Alix Paultre, editor of Electronic Design, has talked with Kenny Yoon, Business Development Manager for South Korea and India at KDPOF, about using optical networking to empower advanced automotive functionality. KDPOF provides innovative high-speed optical networking for harsh environments. Making gigabit communications over fiber optics a reality, KDPOF technology supplies 1-Gb/s plastic optical fiber (POF) links for automotive, industrial, and home networks.
Tasks and Responsibilities
- Verify digital logic using SystemVerilog and reusable, standardized methodologies. Verify digital systems that use both custom and standard IP components and interconnects, including microprocessor cores and hierarchical memory subsystems.
- Contribute to verification and modeling at the chip top level.
- Debug tests with design engineers to deliver functionally correct design blocks. Work closely with the design and test teams to define test specifications, verification plans and manufacturing transfer.
Tasks and Responsibilities
- Specification of the analog and mixed signal blocks that are embedded in the system (ADC, DAC, PLL, data interfaces, optoelectronics …).
- Design (from schematic to full verification at extracted level) of the analog and mixed-signal blocks in sub-nanometric CMOS processes. It means being involved in the full AMS design flow: system-level design, schematic, layout and full verification.
- Definition of layout guidelines for layout engineers and review of their work.
- Collaboration with the test engineers for the testing definition of the fabricated ICs. Review and analysis of lab characterization data for validation and correlation with simulation results.
