Venture Capital Finalist of the 2018 European Photonics Venture Forum

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Carlos Pardo demonstrating KDPOF's optical gigabit connectivity

Carlos Pardo demonstrating KDPOF’s optical gigabit connectivity

KDPOF has been nominated as a Venture Capital finalist at the 4th edition of the Tech Tour 2018 European Photonics Venture Forum (EPVF) on May 29-30, 2018 in Barcelona, Spain. The event was hosted at ICFO (The Institute of Photonic Sciences) with the following supporters: the EU and the European projects ACTPHAST 4.0, SECPhO, as well as Photonics21, Fotónica21, and ECOP (European Centres for Outreach in Photonics). The European Photonics Venture Forum is an annual event held in a new city each year, featuring the activities of Europe’s leading photonics clusters including all technical applications of light such as lasers, photovoltaics, lighting, screens and displays, sensors, optical fibers, and optoelectronics.

“With the nomination, we are happy that KDPOF is one of eight photonics companies recognized as the Forum’s best quartile to present at the European Venture Contest Final 2018, which is the flagship final event of the Venture Contest,” concluded Carlos Pardo, CEO and Co-founder of KDPOF. For each of the past 10 years, the European Venture Contest has attracted over 1,000 innovative companies who compete to be selected in one of the Venture Forums, where time-to-investment will be shortened and the window-to-investors will be widened. It will be held on December 10-11, 2018 in Duesseldorf, Germany.

Fabless semiconductor supplier KDPOF has been nominated for their innovative gigabit and long-reach communications over Plastic Optical Fiber (POF). Making gigabit communications over POF a reality, KDPOF technology supplies 1 Gbps POF links for automotive, industrial, and home networks. The adaptive and efficient system works with a wide range of optoelectronics and low-cost large core optical fibers, thus delivering low risks, low costs, and short time-to-market for carmakers. KDPOF offer their technology as either ASIC or IP (Intellectual Property) to be integrated in SoCs (System-on-Chips).